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This little dude’s mama must be really proud. She finally got to be “home” again. The little boy was introduced to his new family a few days ago. In the clip you see, the little boy’s mama picked her son up from his previous home just to be able to introduce him to her new family.
It’s time for the new 2016 year to commence. This year is a big one for the music industry and it is poised to be a banner year for music. The music business is getting ready for the new year. Whether it’s been awhile since they last had a birthday party, or they are pulling together for an upcoming event, no one’s exempt from a birthday party.
I’m currently out of the loop on any student/young vocal artists who have lined up their own album deals. However, I do hear this week that a new young and promising singer, (who can
if you´re not familiar with this crack, first of all, this is the best voice.This invention relates to a vertical hollow heat sink made of synthetic resin. More specifically, this invention relates to a vertical hollow heat sink which is suitable for electronic parts such as a semiconductor device or a diode laser. The vertical hollow heat sink is particularly suitable for cooling a semiconductor chip which is to be mounted on a printed circuit board through its back surface.
FIG. 1 shows a vertical hollow heat sink which has been proposed for cooling a semiconductor chip through its back surface. In this vertical hollow heat sink, a circuit pattern is first printed on a sheet 1 of insulating material such as synthetic resin, ceramic or glass. In the printed circuit pattern, a plurality of holes 2 are formed at proper locations. Then the circuit pattern is baked, so as to fix the printed circuit pattern to the sheet 1. The pattern-printed sheet 1 is then peeled to form a hollow portion 3. The hollow portion 3 is heated for forming a recess (not shown). The recess is filled with a filler 4. The filler 4 is formed of heat conductive material such as heat conductive resin. The remaining elements are completed by baking.
In the conventional vertical hollow heat sink described above, however, if the heat conductive resin is baked at a temperature of about 160.degree. C. for more than 20 minutes, the heat conductive resin becomes brittle, so that the contact between the heated surface of the hollow portion 3 and the filler 4 is apt to become poor. Further, the heat conductive resin is baked for a long period of time, so that the rate of synthesis of the heat conductive resin becomes lowered.
Furthermore, since the heat conductive resin is enclosed within the hollow portion 3, the synthetic resin which is constituting the hollow portion 3 cannot be so heat resistant as the heat conductive resin. In the conventional vertical hollow heat sink, therefore, the heat conductive resin is heated to a temperature of about 160.degree. C. to cure the hollow portion 3. Therefore, the heat conductive resin is apt to become brittle.
When the semiconductor chip is mounted on the printed circuit board, the semiconductor chip is usually heated to about 150.degree. C. to melt an electrically conductive material for connecting the chip with a lead. Thus, in the conventional vertical hollow heat sink, the hollow portion 3 is heated to about 150.degree. C. to heat the heat conduct